Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint
出版年份 2022 全文链接
标题
Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint
作者
关键词
Al/Cu dissimilar welding, Laser soldering, Surface modification, Microstructure, Mechanical properties
出版物
MATERIALS & DESIGN
Volume -, Issue -, Pages 110485
出版商
Elsevier BV
发表日期
2022-02-23
DOI
10.1016/j.matdes.2022.110485
参考文献
相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。- Study of porosity suppression in oscillating laser-MIG hybrid welding of AA6082 aluminum alloy
- (2021) Lei Wang et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints
- (2021) Xiaowu Hu et al. Journal of Manufacturing Processes
- In-situ reactions and mechanical properties of 6061 aluminum alloy weld joint with SiCp by laser melting injection
- (2021) Boan Xu et al. MATERIALS & DESIGN
- Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient
- (2021) Yuanyuan Qiao et al. ACTA MATERIALIA
- Dynamic Weld evolution during ultrasonic welding of Cu–Al joints
- (2021) Qiuchen Ma et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Effect of the scanning path on the nanosecond pulse laser welded Al/Cu lapped joint
- (2021) Baohua Zhu et al. OPTICS AND LASER TECHNOLOGY
- Numerical and experimental study on laser soldering process of SnAgCu lead-free solder
- (2021) Zifan Yang et al. MATERIALS CHEMISTRY AND PHYSICS
- A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering
- (2020) Anil Kunwar et al. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
- Effect of wire composition on microstructure and properties of 6063 aluminium alloy hybrid synchronous pulse CMT welded joints
- (2020) Peng-Cheng Huan et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux
- (2020) Haozhong Wang et al. Journal of Manufacturing Processes
- Unveiling non-equilibrium metallurgical phases in dissimilar Al-Cu joints processed by vaporizing foil actuator welding
- (2019) Kaifeng Wang et al. MATERIALS & DESIGN
- Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints
- (2018) Anil Kunwar et al. MICROELECTRONICS RELIABILITY
- Multi-objective optimization on laser solder jet bonding process in head gimbal assembly using the response surface methodology
- (2018) J. Deeying et al. OPTICS AND LASER TECHNOLOGY
- Local structural changes induced by ion bombardment in magnetron sputtered ZnO: Al films: Raman, XPS, and XAS study
- (2018) Fanping Meng et al. SURFACE & COATINGS TECHNOLOGY
- New solid-state die-attach method using silver foil bonded on aluminum substrate by eutectic reaction
- (2018) Shao-Wei Fu et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Investigation of soldering process and interfacial microstructure evolution for the formation of full Cu3Sn joints in electronic packaging
- (2017) Peng Yao et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad
- (2015) Hiroshi Nishikawa et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Microstructure design and dissolution behavior between 2024 Al/Sn with the ultrasonic-associated soldering
- (2012) Yuanxing Li et al. MATERIALS & DESIGN
- Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
- (2010) J.F. Li et al. ACTA MATERIALIA
- A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process
- (2010) K.H. Kim et al. SCRIPTA MATERIALIA
- Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
- (2009) Zongjie Han et al. JOURNAL OF ELECTRONIC PACKAGING
- Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys
- (2008) Kazuhiro Nogita et al. SCRIPTA MATERIALIA
- Size dependent interface energy and its applications
- (2008) Q. Jiang et al. SURFACE SCIENCE REPORTS
- Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology
- (2008) Zong-jie HAN et al. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
- Effects of soft beam energy on the microstructure of Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application
- (2007) C.W. Tan et al. OPTICS AND LASERS IN ENGINEERING
Become a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get StartedAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started