Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux
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Title
Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux
Authors
Keywords
Lead-free solder, Carbon nanotubes, Electroless modification, Ultrasonic vibration, Microstructural evolution, Fracture type
Journal
Journal of Manufacturing Processes
Volume 62, Issue -, Pages 291-301
Publisher
Elsevier BV
Online
2020-12-30
DOI
10.1016/j.jmapro.2020.12.020
References
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