Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints

Effect of ultrasonic field on grain refinement and stress relaxation of Be films by thermal evaporation

(2020) Bingchi Luo et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials

Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints

(2020) Haozhong Wang et al.   MATERIALS CHARACTERIZATION

Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint

(2020) Jinxuan Cheng et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Ultrasound-induced transient liquid-phase bonding of Mg/Cu dissimilar metals with Zn interlayer in air

(2020) Zhiyong Mao et al.   MATERIALS LETTERS

Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

(2020) Yong Xiao et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations

(2020) Xiaoyang Bi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effects of ultrasonic peening treatment in three directions on grain refinement and anisotropy of cold metal transfer additive manufactured Ti-6Al-4V thin wall structure

(2020) Jian Gou et al.   Journal of Manufacturing Processes

Effect of ultrasound on microstructure evolution of friction stir welded aluminum alloys

(2020) Yanying Hu et al.   Journal of Manufacturing Processes

A study on wettability and formation of intermetallic phase between Co–Cr–Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages

(2020) Tin Tin Kyaw et al.   INTERMETALLICS

The influence of ultrasonic vibration-assisted processing on mode-I fracture toughness of CFRP-bonded joints

(2020) Guanxia Yang et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin

(2020) Xuemin Sun et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of recrystallization on plasticity, fracture toughness and stress corrosion cracking of a high-alloying Al-Zn-Mg-Cu alloy

(2020) Mingyang Yu et al.   MATERIALS LETTERS

Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties

(2020) Wenwu Zhang et al.   ULTRASONICS SONOCHEMISTRY

Tuning the microstructure morphology and genetic mechanical properties of 2219 Al alloy with ultrasonic treatment

(2020) Yun Zhang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Mechanism of ultrasonic-assisted transient liquid phase bonding of 6061 Al alloy with cladded Zn-Al alloy in air

(2020) Qiang Jia et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Soldering porous ceramics through ultrasonic-induced capillary action and cavitation

(2019) Zhiwu Xu et al.   CERAMICS INTERNATIONAL

Effects of Zn on intermetallic compounds and strength of Al/Mg joints ultrasonically soldered in air

(2019) Zhiwu Xu et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film

(2019) Xiaowu Hu et al.   VACUUM

Dissolution and nucleation behavior of Al in Ta/Sn/Al joints during ultrasonic-assisted soldering

(2019) Haifeng Yang et al.   MATERIALS LETTERS

Wetting properties, recrystallization phenomena and interfacial reactions between laser treated Cu substrate and SAC305 solder

(2019) József Hlinka et al.   APPLIED SURFACE SCIENCE

Ultrasonic bonding of 2024 Al alloy using Ni-foam/Sn composite solder at ambient temperature

(2019) Wanli Niu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Grain refinement caused by intensified cavitation within narrow channel and its improvement to ultrasonically soldered Al joint property

(2019) Zhengwei Li et al.   ULTRASONICS SONOCHEMISTRY

Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

(2018) Patrick B. Thompson et al.   ENGINEERING FRACTURE MECHANICS

Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder

(2018) Yong Xiao et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Microstructural evolution of SiC joints soldered using Zn–Al filler metals with the assistance of ultrasound

(2018) Bingzhi Wu et al.   ULTRASONICS SONOCHEMISTRY

Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process

(2018) Z.L. Li et al.   ULTRASONICS SONOCHEMISTRY

Effect of welding time on microstructure and mechanical properties of Al-Ti ultrasonic spot welds

(2018) L. Zhou et al.   Journal of Manufacturing Processes

Effect of ultrasound on dissolution of Al in Sn

(2018) Yun Liu et al.   ULTRASONICS SONOCHEMISTRY

Ultrasonic semi-solid soldering 6061 aluminum alloys joint with Sn-9Zn solder reinforced with nano/nano+micron Al2O3 particles

(2018) Ding Min   ULTRASONICS SONOCHEMISTRY

Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering

(2017) Ai Ting Tan et al.   ULTRASONICS SONOCHEMISTRY

Effects of roughness on the wettability of high temperature wetting system

(2016) Mao Wu et al.   SURFACE & COATINGS TECHNOLOGY

Wetting characteristics of Cu–xZn layers for Sn–3.0Ag–0.5Cu solders

(2013) Ji Hyun Lee et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

(2012) Cheng-Ying Ho et al.   MATERIALS LETTERS