New solid-state die-attach method using silver foil bonded on aluminum substrate by eutectic reaction

Published 2018 View Full Article

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Title
New solid-state die-attach method using silver foil bonded on aluminum substrate by eutectic reaction
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume -, Issue -, Pages -
Publisher
Elsevier BV
Online
2018-09-26
DOI
10.1016/j.jallcom.2018.09.254

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