A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering

Authors

Keywords

Intermetallic compound, Neural network, Finite element method (FEM), Laser parameters, Lead-free solders, Morphology

Journal

Volume 50, Issue -, Pages 115-127

Publisher

Elsevier BV

Online

2020-03-08

DOI

10.1016/j.jmst.2019.12.036

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