Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Published 2009 View Full Article

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Title
Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume 131, Issue 2, Pages 021004
Publisher
ASME International
Online
2009-04-29
DOI
10.1115/1.3103932

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