Microstructure design and dissolution behavior between 2024 Al/Sn with the ultrasonic-associated soldering

Published 2012 View Full Article

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Title
Microstructure design and dissolution behavior between 2024 Al/Sn with the ultrasonic-associated soldering
Authors
Keywords
-
Journal
MATERIALS & DESIGN
Volume 40, Issue -, Pages 427-432
Publisher
Elsevier BV
Online
2012-04-18
DOI
10.1016/j.matdes.2012.04.002

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