Numerical and experimental study on laser soldering process of SnAgCu lead-free solder

Wetting properties, recrystallization phenomena and interfacial reactions between laser treated Cu substrate and SAC305 solder

(2019) József Hlinka et al.   APPLIED SURFACE SCIENCE

Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints

(2019) Jungsoo Kim et al.   APPLIED SURFACE SCIENCE

Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu–Co dual-phase substrate

(2018) Chao Li et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

(2018) Yang Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

(2018) Anil Kunwar et al.   MICROELECTRONICS RELIABILITY

Multi-objective optimization on laser solder jet bonding process in head gimbal assembly using the response surface methodology

(2018) J. Deeying et al.   OPTICS AND LASER TECHNOLOGY

Design and Properties of New Lead-Free Solder Joints Using Sn-3.5Ag-Cu Solder

(2018) Rizk Mostafa Shalaby et al.   Silicon

Indentation Size Effect on Ag Nanoparticle-Modified Graphene/Sn-Ag-Cu Solders

(2017) L. Y. Xu et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packaging

(2017) Jie Wu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Microsupercapacitors as miniaturized energy-storage components for on-chip electronics

(2016) Nana Amponsah Kyeremateng et al.   Nature Nanotechnology

Suppression effect of a steady magnetic field on molten pool during laser remelting

(2015) Liang Wang et al.   APPLIED SURFACE SCIENCE

Interfacial reactions between Cu and SnAgCu solder doped with minor Ni

(2015) Hsi-Kuei Cheng et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial compounds growth of SnAgCu(nano La 2 O 3 )/Cu solder joints based on experiments and FEM

(2015) Liang Zhang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad

(2015) Hiroshi Nishikawa et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Experimental and numerical investigation of temperature distribution and melt pool geometry during pulsed laser welding of Ti6Al4V alloy

(2014) Mohammad Akbari et al.   OPTICS AND LASER TECHNOLOGY

Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology

(2013) Wislei R. Osório et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads

(2013) Yanhong Tian et al.   MATERIALS CHARACTERIZATION

Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint

(2012) Z Zeng et al.   MATERIALS SCIENCE AND TECHNOLOGY

Numerical and experimental study of thermally induced residual stress in the hybrid laser–GMA welding process

(2011) Fanrong Kong et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

(2011) S.Y. Chang et al.   MATERIALS & DESIGN

Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints

(2010) Ming Yang et al.   JOURNAL OF ELECTRONIC MATERIALS

A review of mechanical properties of lead-free solders for electronic packaging

(2009) Hongtao Ma et al.   JOURNAL OF MATERIALS SCIENCE

Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

(2008) Jicheng Gong et al.   ACTA MATERIALIA

Material properties for process simulation

(2008) Z. Guo et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of surface finish on interfacial reactions of Cu/Sn–Ag–Cu/Cu(ENIG) sandwich solder joints

(2006) Jeong-Won Yoon et al.   JOURNAL OF ALLOYS AND COMPOUNDS