Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

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Title
Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 80, Issue -, Pages 55-67
Publisher
Elsevier BV
Online
2017-11-25
DOI
10.1016/j.microrel.2017.11.016

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