A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits
Published 2023 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits
Authors
Keywords
-
Journal
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2023-01-03
DOI
10.1007/s00170-022-10775-2
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Corrosion Inhibition and the Synergistic Effect of Three Different Inhibitors on Copper Surface
- (2022) Tongxi Wu et al. ECS Journal of Solid State Science and Technology
- Effect of Corrosion Inhibitor BTA on Silica Particles and their Adsorption on Copper Surface in Copper Interconnection CMP
- (2022) Yazhen Wang et al. ECS Journal of Solid State Science and Technology
- Role of Potassium Tolyltriazole as an Inhibitor in H2O2-Based Slurry on Cu/Ru Patterned Wafer CMP
- (2022) Yuan Tian et al. ECS Journal of Solid State Science and Technology
- Insights into triazole derivatives as potential corrosion inhibitors in CMP process: Experimental evaluation and theoretical analysis
- (2022) Wei Li et al. APPLIED SURFACE SCIENCE
- The effect of structural properties of benzo derivative on the inhibition performance for copper corrosion in alkaline medium: Experimental and theoretical investigations
- (2022) Wei Li et al. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
- Effect and mechanism analysis of sarcosine on the chemical mechanical polishing performance of copper film for GLSI
- (2022) Yinchan Zhang et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization
- (2021) Jihoon Seo JOURNAL OF MATERIALS RESEARCH
- Chemical mechanical polishing for sapphire wafers using a developed slurry
- (2021) Zhenyu Zhang et al. Journal of Manufacturing Processes
- Dishing-free chemical mechanical planarization for copper films
- (2021) Sang-Su Yun et al. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
- Potassium persulfate as an effective oxidizer for chemical mechanical polishing of GCr15 bearing steel
- (2021) Ting Zhao et al. JOURNAL OF APPLIED ELECTROCHEMISTRY
- Effect of EDTA-based alkaline cleaning solution on TAZ removal in post CMP cleaning of copper interconnection
- (2021) Da Yin et al. MATERIALS RESEARCH BULLETIN
- The inhibition mechanism and adsorption behavior of three purine derivatives on the corrosion of copper in alkaline artificial seawater: Structure and performance
- (2021) Xiaomeng Guo et al. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
- DFT study on the adsorption of deprotonated benzotriazole on the defective copper surfaces
- (2021) Fengting Li et al. CORROSION SCIENCE
- Roles and mechanistic analysis of adenine as a green inhibitor in chemical mechanical polishing
- (2021) Nengyuan Zeng et al. JOURNAL OF APPLIED ELECTROCHEMISTRY
- Effects of pH and H2O2 on the chemical mechanical polishing of titanium alloys
- (2021) Changbang Deng et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- A review: green chemical mechanical polishing for metals and brittle wafers
- (2021) Lu Liu et al. JOURNAL OF PHYSICS D-APPLIED PHYSICS
- The Effect of Cu2+ Ions and Glycine Complex on Chemical Mechanical Polishing (CMP) Performance of SiC Substrates
- (2021) Ping Zhang et al. TRIBOLOGY LETTERS
- Effect of Intermolecular Interaction of Compound Surfactant on Particle Removal in Post-Cu CMP Cleaning
- (2021) Lijing Qu et al. ECS Journal of Solid State Science and Technology
- Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing
- (2021) Peili Gao et al. Science China-Materials
- A novel slurry for chemical mechanical polishing of single crystal diamond
- (2021) Longxing Liao et al. APPLIED SURFACE SCIENCE
- Surface corrosion inhibition mechanism of sarcosine as a green novel inhibitor on a novel barrier layer material of cobalt in copper film CMP for GLSI
- (2021) Yinchan Zhang et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- Study on chemical effects of H2O2 and glycine in the Copper CMP process using ReaxFF MD
- (2020) Xiaoguang Guo et al. APPLIED SURFACE SCIENCE
- Potassium persulfate as an oxidizer in chemical mechanical polishing slurries relevant for copper interconnects with cobalt barrier layers
- (2020) Lifei Zhang et al. JOURNAL OF MATERIALS SCIENCE
- Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection
- (2020) Da Yin et al. MATERIALS CHEMISTRY AND PHYSICS
- Study on effect of complexing agents on Co oxidation/dissolution for chemical-mechanical polishing and cleaning process
- (2020) Ohsung Kwon et al. MICROELECTRONIC ENGINEERING
- Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment
- (2020) Tengda Ma et al. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
- Advanced polishing, grinding and finishing processes for various manufacturing applications: a review
- (2020) Zhao-Wei Zhong MATERIALS AND MANUFACTURING PROCESSES
- The synergistic inhibitory effect and density functional theory study of 2,2’-[[(Methyl-1H-benzotriazol-1-yl)methyl]imino]bisethanol and potassium oleate on copper in H2O2 based alkaline slurries
- (2020) Lianjun Hu et al. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
- Tungsten passivation layer (WO3) formation mechanisms during chemical mechanical planarization in the presence of oxidizers
- (2020) Maneesh Kumar Poddar et al. APPLIED SURFACE SCIENCE
- Synergistic effect of LABSA/JFCE combined surfactant system on the removal of particles on copper wafer surface
- (2020) Da Yin et al. MATERIALS CHEMISTRY AND PHYSICS
- Synergy between dodecylbenzenesulfonic acid and isomeric alcohol polyoxyethylene ether for nano-scale scratch reduction in copper chemical mechanical polishing
- (2020) Chong Luo et al. TRIBOLOGY INTERNATIONAL
- Evaluation of purine based compounds as the inhibitors of copper corrosion in simulated body fluid
- (2019) Marija B. Petrović Mihajlović et al. Results in Physics
- Development of a novel chemical mechanical polishing slurry and its polishing mechanisms on a nickel alloy
- (2019) Zhenyu Zhang et al. APPLIED SURFACE SCIENCE
- Study on the film forming mechanism, corrosion inhibition effect and synergistic action of two different inhibitors on copper surface chemical mechanical polishing for GLSI
- (2019) Jiakai Zhou et al. APPLIED SURFACE SCIENCE
- Atomistic Insights into Cu Chemical Mechanical Polishing Mechanism in Aqueous Hydrogen Peroxide and Glycine: ReaxFF Reactive Molecular Dynamics Simulations
- (2019) Jialin Wen et al. Journal of Physical Chemistry C
- Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMP
- (2019) Qi Wang et al. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
- Roles and mechanism analysis of chitosan as a green additive in low-tech node copper film chemical mechanical polishing
- (2019) Jiakai Zhou et al. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
- A novel approach of chemical mechanical polishing for a titanium alloy using an environment-friendly slurry
- (2018) Zhenyu Zhang et al. APPLIED SURFACE SCIENCE
- Inhibition effect of glycine on molybdenum corrosion during CMP in alkaline H 2 O 2 based abrasive free slurry
- (2018) Guang Yang et al. APPLIED SURFACE SCIENCE
- Effect of Chelating Agent and Ammonium Dodecyl Sulfate on the Interfacial Behavior of Copper CMP for GLSI
- (2018) Kai Zhang et al. ECS Journal of Solid State Science and Technology
- Integrated electrochemical analysis of polyvinyl pyrrolidone (PVP) as the inhibitor for copper chemical mechanical planarization (Cu-CMP)
- (2018) Guang Yang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Environment friendly chemical mechanical polishing of copper
- (2018) Zhenyu Zhang et al. APPLIED SURFACE SCIENCE
- Electrochemical study on metal corrosion in chemical mechanical planarization process
- (2017) Seiichi Kondo et al. JAPANESE JOURNAL OF APPLIED PHYSICS
- Influence of slurry components on copper CMP performance in alkaline slurry
- (2017) Qinzhi Xu et al. MICROELECTRONIC ENGINEERING
- Study on the Weakly Alkaline Slurry of Copper Chemical Mechanical Planarization for GLSI
- (2017) Caihong Yao et al. ECS Journal of Solid State Science and Technology
- Effect of Non-Ionic Surfactant on Copper Dishing and Dielectric Erosion Correction in Alkaline Barrier CMP Solution Free of Inhibitors
- (2017) Wenqian Zhang et al. ECS Journal of Solid State Science and Technology
- Atomistic Mechanisms of Chemical Mechanical Polishing of a Cu Surface in Aqueous H2O2: Tight-Binding Quantum Chemical Molecular Dynamics Simulations
- (2016) Kentaro Kawaguchi et al. ACS Applied Materials & Interfaces
- Effect of a novel chelating agent on defect removal during post-CMP cleaning
- (2016) Jiao Hong et al. APPLIED SURFACE SCIENCE
- A study on exploring the alkaline copper CMP slurry without inhibitors to achieve high planarization efficiency
- (2016) Xiaodong Luan et al. MICROELECTRONIC ENGINEERING
- Effect of secondary inhibitors on material removal rate and nano-roughness of Cu chemical mechanical planarization
- (2016) Sunjae Jang et al. Materials Express
- Effect of glycine on copper CMP
- (2016) Soocheon Jang et al. International Journal of Precision Engineering and Manufacturing-Green Technology
- The optimization of chemical mechanical planarization process-parameters of c-plane gallium-nitride using Taguchi method and grey relational analysis
- (2016) D.M. Nelabhotla et al. MATERIALS & DESIGN
- Chemical and Mechanical Aspects of a Co-Cu Planarization Scheme Based on an Alkaline Slurry Formulation
- (2015) M. C. Turk et al. ECS Journal of Solid State Science and Technology
- Shallow Trench Isolation Chemical Mechanical Planarization: A Review
- (2015) Ramanathan Srinivasan et al. ECS Journal of Solid State Science and Technology
- BTA Free Alkaline Slurries Developed for Copper and Barrier CMP
- (2015) Baoguo Zhang et al. ECS Journal of Solid State Science and Technology
- Chemical roles on Cu-slurry interface during copper chemical mechanical planarization
- (2014) Jing Li et al. APPLIED SURFACE SCIENCE
- A new corrosion inhibitor for copper protection
- (2014) G. Tansuğ et al. CORROSION SCIENCE
- The selective leaching of copper from a gold–copper concentrate in glycine solutions
- (2014) E.A. Oraby et al. HYDROMETALLURGY
- Characterization of non-amine-based post-copper chemical mechanical planarization cleaning solution
- (2014) Ramachandran Manivannan et al. MICROELECTRONIC ENGINEERING
- Effect of chelating agent on benzotriazole removal during post copper chemical mechanical polishing cleaning
- (2014) Yingxin Miao et al. MICROELECTRONIC ENGINEERING
- 1,2,4-Triazole as a corrosion inhibitor in copper chemical mechanical polishing
- (2014) Liang Jiang et al. THIN SOLID FILMS
- SERS and DFT study of copper surfaces coated with corrosion inhibitor
- (2014) Maurizio Muniz-Miranda et al. Beilstein Journal of Nanotechnology
- Functions of Trilon® P as a polyamine in copper chemical mechanical polishing
- (2013) Liang Jiang et al. APPLIED SURFACE SCIENCE
- In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone
- (2013) Zilian Qu et al. MICROELECTRONIC ENGINEERING
- Chemical and Mechanical Properties of Cu Surface Reaction Layers in Cu-CMP to Improve Planarization
- (2013) Tsuyoshi Kanki et al. ECS Journal of Solid State Science and Technology
- Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization
- (2012) James Kelly et al. COMPTES RENDUS CHIMIE
- Synergistic roles of mixed inhibitors and the application of mixed complexing ligands in copper chemical mechanical polishing
- (2011) Ning Wang et al. MICROELECTRONIC ENGINEERING
- Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance
- (2010) Magi Nagar et al. ELECTROCHIMICA ACTA
- Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurry. Part I. Elucidating slurry chemistry
- (2010) Magi Nagar et al. ELECTROCHIMICA ACTA
- Fundamental Study of Chemical–Mechanical Polishing Slurry of Cobalt Barrier Metal for the Next-Generation Interconnect Process
- (2010) Hideaki Nishizawa et al. JAPANESE JOURNAL OF APPLIED PHYSICS
- Electrochemical characterization of copper chemical mechanical polishing in l-glutamic acid–hydrogen peroxide-based slurries
- (2010) Noyel Victoria Selvam et al. JOURNAL OF SOLID STATE ELECTROCHEMISTRY
- Effect of pH on Material Removal Rate of Cu in Abrasive-Free Polishing
- (2009) Zhang Wei et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Tartaric Acid as a Complexing Agent for Selective Removal of Tantalum and Copper in CMP
- (2008) S. V. S. B. Janjam et al. ELECTROCHEMICAL AND SOLID STATE LETTERS
- Investigation of dissolution inhibitors for electrochemical mechanical planarization of copper using beta-alanine as a complexing agent
- (2008) B. K. Klug et al. JOURNAL OF APPLIED ELECTROCHEMISTRY
- Osteopontin: A Novel Cytokine Involved in the Regulation of Mycobacterium avium subspecies paratuberculosis Infection in Periparturient Dairy Cattle
- (2008) E.L. Karcher et al. JOURNAL OF DAIRY SCIENCE
- Achievement of high planarization efficiency in CMP of copper at a reduced down pressure
- (2008) S. Pandija et al. MICROELECTRONIC ENGINEERING
- Relative roles of acetic acid, dodecyl sulfate and benzotriazole in chemical mechanical and electrochemical mechanical planarization of copper
- (2007) P.C. Goonetilleke et al. APPLIED SURFACE SCIENCE
Publish scientific posters with Peeref
Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.
Learn MoreBecome a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get Started