Atomistic Insights into Cu Chemical Mechanical Polishing Mechanism in Aqueous Hydrogen Peroxide and Glycine: ReaxFF Reactive Molecular Dynamics Simulations

Title
Atomistic Insights into Cu Chemical Mechanical Polishing Mechanism in Aqueous Hydrogen Peroxide and Glycine: ReaxFF Reactive Molecular Dynamics Simulations
Authors
Keywords
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Journal
Journal of Physical Chemistry C
Volume 123, Issue 43, Pages 26467-26474
Publisher
American Chemical Society (ACS)
Online
2019-10-11
DOI
10.1021/acs.jpcc.9b08466

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