Environment friendly chemical mechanical polishing of copper

Published 2018 View Full Article

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Title
Environment friendly chemical mechanical polishing of copper
Authors
Keywords
Cu, COS, CMP, H, 2, O, 2, Chelating
Journal
APPLIED SURFACE SCIENCE
Volume 467-468, Issue -, Pages 5-11
Publisher
Elsevier BV
Online
2018-10-16
DOI
10.1016/j.apsusc.2018.10.133

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