Influence of slurry components on copper CMP performance in alkaline slurry

Published 2017 View Full Article

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Title
Influence of slurry components on copper CMP performance in alkaline slurry
Authors
Keywords
Chemical mechanical planarization, Slurry components, Material removal rate, Within-wafer non-uniformity, Surface roughness
Journal
MICROELECTRONIC ENGINEERING
Volume 183-184, Issue -, Pages 1-11
Publisher
Elsevier BV
Online
2017-10-03
DOI
10.1016/j.mee.2017.10.002

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