Study on the Weakly Alkaline Slurry of Copper Chemical Mechanical Planarization for GLSI

Effect of a novel chelating agent on defect removal during post-CMP cleaning

(2016) Jiao Hong et al.   APPLIED SURFACE SCIENCE

A study on exploring the alkaline copper CMP slurry without inhibitors to achieve high planarization efficiency

(2016) Xiaodong Luan et al.   MICROELECTRONIC ENGINEERING

Synergistic Effect of Glycine and BTA on Step Height Reduction Efficiency after Copper CMP in Weakly Alkaline Slurry

(2016) Chenqi Yan et al.   ECS Journal of Solid State Science and Technology

Chemical and Mechanical Aspects of a Co-Cu Planarization Scheme Based on an Alkaline Slurry Formulation

(2015) M. C. Turk et al.   ECS Journal of Solid State Science and Technology

BTA Free Alkaline Slurries Developed for Copper and Barrier CMP

(2015) Baoguo Zhang et al.   ECS Journal of Solid State Science and Technology

Chemical roles on Cu-slurry interface during copper chemical mechanical planarization

(2014) Jing Li et al.   APPLIED SURFACE SCIENCE

Stability of weakly alkaline barrier slurry with the high selectivity

(2014) Xiaodong Luan et al.   MICROELECTRONIC ENGINEERING

Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry

(2014) Yan Zhou et al.   SURFACE & COATINGS TECHNOLOGY

Three-dimensional porous Ni film electrodeposited on Ni foam: High performance and low-cost catalytic electrode for H2O2 electrooxidation in KOH solution

(2013) Fan Yang et al.   ELECTROCHIMICA ACTA

Electrode engineering for improving resistive switching performance in single crystalline CeO2 thin films

(2012) Zhaoliang Liao et al.   SOLID-STATE ELECTRONICS

Influence of carbon dioxide gas on internal stress and film density of tin oxide films grown by magnetron sputtering

(2010) Toru Ashida et al.   THIN SOLID FILMS