Chemical and Mechanical Properties of Cu Surface Reaction Layers in Cu-CMP to Improve Planarization

Published 2013 View Full Article

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Title
Chemical and Mechanical Properties of Cu Surface Reaction Layers in Cu-CMP to Improve Planarization
Authors
Keywords
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Journal
ECS Journal of Solid State Science and Technology
Volume 2, Issue 9, Pages P375-P379
Publisher
The Electrochemical Society
Online
2013-07-05
DOI
10.1149/2.023309jss
References
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