Surface effect induced Cu-Cu bonding by Cu nanosolder paste

Authors

Keywords

Cu-Cu bonding, Nanoparticles, Nanosolder paste, Surface effect, Sintering

Journal

MATERIALS LETTERS

Volume 184, Issue -, Pages 193-196

Publisher

Elsevier BV

Online

2016-08-23

DOI

10.1016/j.matlet.2016.08.085

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