Thermal simulation of joints with high thermal conductivities for power electronic devices

Published 2015 View Full Article

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Title
Thermal simulation of joints with high thermal conductivities for power electronic devices
Authors
Keywords
High thermal conductivity joint, Heatsink, Thermal resistance, Uniform thermal spread, Homogeneous temperature distribution, Module design concept
Journal
MICROELECTRONICS RELIABILITY
Volume 55, Issue 7, Pages 1060-1066
Publisher
Elsevier BV
Online
2015-05-05
DOI
10.1016/j.microrel.2015.04.005

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