Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices

Title
Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
Authors
Keywords
Sintering, copper nanoparticles, copper paste, die attachment, power electronic packaging, power electronics
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2019-07-30
DOI
10.1007/s11664-019-07452-8

Ask authors/readers for more resources

Reprint

Contact the author

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now