Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
Published 2019 View Full Article
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Title
Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
Authors
Keywords
Sintering, copper nanoparticles, copper paste, die attachment, power electronic packaging, power electronics
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2019-07-30
DOI
10.1007/s11664-019-07452-8
References
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