Novel interface material used in high power electronic die-attaching on bare Cu substrates

Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications

(2015) Mingyu Li et al.   ACS Applied Materials & Interfaces

Electrical method to measure the transient thermal impedance of insulated gate bipolar transistor module

(2015) Mei-Yu Wang et al.   IET Power Electronics

Low temperature plasma sintering of silver nanoparticles

(2014) Siyuan Ma et al.   APPLIED SURFACE SCIENCE

Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

(2014) Shancan Fu et al.   MATERIALS LETTERS

Chip-Bonding on Copper by Pressureless Sintering of Nanosilver Paste Under Controlled Atmosphere

(2014) Hanguang Zheng et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Simplification of the Nanosilver Sintering Process for Large-Area Semiconductor Chip Bonding: Reduction of Hot-Pressing Temperature Below 200/spl deg/C

(2013) Kewei Xiao et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

An innovative method for joining materials at low temperature using silver (nano)particles derived from [AgO2C(CH2OCH2)3H]

(2012) Annerose Oestreicher et al.   APPLIED SURFACE SCIENCE

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

(2012) Cheng-Ying Ho et al.   JOURNAL OF MATERIALS SCIENCE

Transient Thermal Performance of IGBT Power Modules Attached by Low-Temperature Sintered Nanosilver

(2011) Gang Chen et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Mechanical properties of nano-silver joints as die attach materials

(2011) Kim S. Siow   JOURNAL OF ALLOYS AND COMPOUNDS

Silver Nanoparticle Paste for Low-Temperature Bonding of Copper

(2011) Hani Alarifi et al.   JOURNAL OF ELECTRONIC MATERIALS

Low-temperature low-pressure die attach with hybrid silver particle paste

(2011) K. Suganuma et al.   MICROELECTRONICS RELIABILITY

Fast Preparation of Printable Highly Conductive Polymer Nanocomposites by Thermal Decomposition of Silver Carboxylate and Sintering of Silver Nanoparticles

(2010) Rongwei Zhang et al.   ACS Applied Materials & Interfaces

Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles

(2010) Masafumi Kuramot et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

(2009) T.G. Lei et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Study of Bonding Technology Using Silver Nanoparticles

(2008) Toshiaki Morita et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles

(2008) Toshiaki Morita et al.   MATERIALS TRANSACTIONS