Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
出版年份 2021 全文链接
标题
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
作者
关键词
Nanocrystalline materials, Grains and interfaces, Powder methods, Sintered silver, Lead-free, Die-attach materials
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 866, Issue -, Pages 158783
出版商
Elsevier BV
发表日期
2021-02-03
DOI
10.1016/j.jallcom.2021.158783
参考文献
相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。- Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications
- (2020) Shunichi Koga et al. JOURNAL OF ELECTRONIC MATERIALS
- Influence of Aging Atmosphere on the Thermal Stability of Low-Temperature Rapidly Sintered Cu Nanoparticle Paste Joint
- (2020) Jiacheng Xie et al. JOURNAL OF ELECTRONIC MATERIALS
- Fabrication of high-strength Cu–Cu joint by low-temperature sintering micron–nano Cu composite paste
- (2020) Yang Peng et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol
- (2020) Sri Krishna Bhogaraju et al. SCRIPTA MATERIALIA
- High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles
- (2020) Yang Zuo et al. MATERIALS LETTERS
- Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging
- (2020) Sri Krishna Bhogaraju et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Ambient Aqueous-Phase Synthesis of Copper Nanoparticles and Nanopastes with Low-Temperature Sintering and Ultra-High Bonding Abilities
- (2019) Yoichi Kamikoriyama et al. Scientific Reports
- Novel Cu-Ag Composite Nanoparticle Paste for Low Temperature Bonding
- (2019) Jiaxin Liu et al. MATERIALS LETTERS
- Influence of sintering environment on silver sintered on copper substrate
- (2019) K. S. Siow et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles
- (2019) Runhua Gao et al. JOURNAL OF ELECTRONIC MATERIALS
- Characterization of the die-attach process via low-temperature reduction of Cu formate in air
- (2019) Woo Lim Choi et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- SiC chip attachment sintered by nanosilver paste and their shear strength evaluation
- (2019) Hongqiang Zhang et al. Welding in the World
- Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
- (2019) Luca Del Carro et al. JOURNAL OF ELECTRONIC MATERIALS
- Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N2 atmosphere
- (2019) Chuantong Chen et al. JOURNAL OF MATERIALS SCIENCE
- High-temperature stability of copper nanoparticles through Cu@Ag nanostructures
- (2019) Thomas Michaud et al. JOURNAL OF NANOPARTICLE RESEARCH
- Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material
- (2019) K. S. Siow et al. METALS AND MATERIALS INTERNATIONAL
- Micron-sized Ag flake particles direct die bonding on electroless Ni–P-finished DBC substrate: low-temperature pressure-free sintering, bonding mechanism and high-temperature aging reliability
- (2019) Chuantong Chen et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Preparation of copper nanoparticles for metal-metal bonding by aqueous reduction with d-glucose and PVP
- (2019) Giuseppe Granata et al. CHEMICAL ENGINEERING SCIENCE
- Low temperature de-oxidation for copper surface by catalyzed formic acid vapor
- (2018) Pei-Wen Chou et al. APPLIED SURFACE SCIENCE
- Technological aspects of silver particle sintering for electronic packaging
- (2018) Jan Felba CIRCUIT WORLD
- In Situ Study of Reduction Process of CuO Paste and Its Effect on Bondability of Cu-to-Cu Joints
- (2018) Takafumi Yao et al. JOURNAL OF ELECTRONIC MATERIALS
- Influence of Cu micro/nano-particles mixture and surface roughness on the shear strength of Cu-Cu joints
- (2018) Yang Zuo et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle
- (2018) Yang Zuo et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device
- (2018) Hao Zhang et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Fabrication of reliable Cu-Cu joints by low temperature bonding isopropanol stabilized Cu nanoparticles in air
- (2018) Yun Mou et al. MATERIALS LETTERS
- How to determine surface roughness of copper substrate for robust pressureless sintered silver in air
- (2018) Meiyu Wang et al. MATERIALS LETTERS
- Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging
- (2018) Hongjun Ji et al. ULTRASONICS SONOCHEMISTRY
- Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding
- (2018) Junjie Li et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications
- (2018) Jeong-Won Yoon et al. Materials
- Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size
- (2018) Chuantong Chen et al. MATERIALS & DESIGN
- Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
- (2018) Yue Gao et al. MATERIALS & DESIGN
- Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications
- (2018) Hongqiang Zhang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air
- (2018) Zheng Zhang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Enhancing Low-Temperature and Pressureless Sintering of Micron Silver Paste Based on an Ether-Type Solvent
- (2017) Hao Zhang, Wanli Li, Yue Gao, Hao Zhang, Jinting Jiu et al. JOURNAL OF ELECTRONIC MATERIALS
- Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres
- (2017) Yue Gao et al. JOURNAL OF ELECTRONIC MATERIALS
- Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates
- (2017) Chun Pei et al. JOURNAL OF ELECTRONIC MATERIALS
- Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250 °C
- (2017) Xiangdong Liu et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Effect of different sizes of Cu nanoparticles on the shear strength of Cu-Cu joints
- (2017) Yang Zuo et al. MATERIALS LETTERS
- Development of Cu-Ag pastes for high temperature sustainable bonding
- (2017) Ching-Huan Hsiao et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Review of silver nanoparticle based die attach materials for high power/temperature applications
- (2017) Seyed Amir Paknejad et al. MICROELECTRONICS RELIABILITY
- Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications
- (2017) Byung-Suk Lee et al. MICROELECTRONICS RELIABILITY
- Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions
- (2017) Yingqiong Yong et al. Scientific Reports
- Antioxidation Properties and Surface Interactions of Polyvinylpyrrolidone-Capped Zerovalent Copper Nanoparticles Synthesized in Supercritical Water
- (2016) Takuya Morioka et al. ACS Applied Materials & Interfaces
- Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles
- (2016) Jingdong Liu et al. ACS Applied Materials & Interfaces
- Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects
- (2016) Y. Y. Dai et al. APPLIED PHYSICS LETTERS
- Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C
- (2016) S.T. Chua et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Microstructure and Joint Properties of Nano-Silver Paste by Ultrasonic-Assisted Pressureless Sintering
- (2016) Yuan Li et al. JOURNAL OF ELECTRONIC MATERIALS
- Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design
- (2016) Chuantong Chen et al. JOURNAL OF ELECTRONIC MATERIALS
- Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
- (2016) K. S. Siow et al. JOURNAL OF ELECTRONIC PACKAGING
- Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation–reduction process
- (2016) Xiangdong Liu et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Novel interface material used in high power electronic die-attaching on bare Cu substrates
- (2016) Su-Yan Zhao et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment
- (2016) Jianfeng Yan et al. Journal of Nanomaterials
- Surface effect induced Cu-Cu bonding by Cu nanosolder paste
- (2016) J.J. Li et al. MATERIALS LETTERS
- Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography
- (2016) Masanori Usui et al. MICROELECTRONICS RELIABILITY
- Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging
- (2016) Xiangdong Liu et al. SCRIPTA MATERIALIA
- The Influence of Pore Size on the Indentation Behavior of Metallic Nanoporous Materials: A Molecular Dynamics Study
- (2016) Daniel Esqué-de los Ojos et al. Materials
- Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications
- (2015) Mingyu Li et al. ACS Applied Materials & Interfaces
- Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
- (2015) Peng Peng et al. ACS Applied Materials & Interfaces
- Influence of nanoparticles content in silver paste on mechanical and electrical properties of LTJT joints
- (2015) Konrad Kiełbasiński et al. ADVANCED POWDER TECHNOLOGY
- Electrical conductivity of porous silver made from sintered nanoparticles
- (2015) Abu Samah Zuruzi et al. Electronic Materials Letters
- Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging
- (2015) Shancan Fu et al. JOURNAL OF ELECTRONIC MATERIALS
- New Bonding Technique Using Copper Oxide Materials
- (2015) Toshiaki Morita et al. MATERIALS TRANSACTIONS
- Joining of Pure Copper Using Cu Nanoparticles Derived from CuO Paste
- (2015) Tomoyuki Fujimoto et al. MATERIALS TRANSACTIONS
- Thermal simulation of joints with high thermal conductivities for power electronic devices
- (2015) T. Ishizaki et al. MICROELECTRONICS RELIABILITY
- Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates
- (2014) S.A. Paknejad et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles
- (2014) Toshitaka Ishizaki et al. JOURNAL OF ELECTRONIC MATERIALS
- Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles
- (2014) Toshitaka Ishizaki et al. JOURNAL OF ELECTRONIC MATERIALS
- Nanocopper Based Solder-Free Electronic Assembly
- (2014) K. Schnabl et al. JOURNAL OF ELECTRONIC MATERIALS
- Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
- (2014) Kim S. Siow JOURNAL OF ELECTRONIC MATERIALS
- Synthesis of copper nanoparticles : An overview of the various methods
- (2014) Bahareh Khodashenas et al. KOREAN JOURNAL OF CHEMICAL ENGINEERING
- Mechanical properties of sintered Ag–Cu die-attach nanopaste for application on SiC device
- (2014) Kim Seah Tan et al. MATERIALS & DESIGN
- Spark Plasma Sintering constrained process parameters of sintered silver paste for connection in power electronic modules: Microstructure, mechanical and thermal properties
- (2014) N. Alayli et al. MATERIALS CHEMISTRY AND PHYSICS
- Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging
- (2014) Shancan Fu et al. MATERIALS LETTERS
- Reliability of Cu nanoparticle joint for high temperature power electronics
- (2014) T. Ishizaki et al. MICROELECTRONICS RELIABILITY
- A metal–metal bonding process using metallic copper nanoparticles produced by reduction of copper oxide nanoparticles
- (2014) Yoshio Kobayashi et al. Journal of Materials Research and Technology-JMR&T
- Thermal stability of Cu@Ag core–shell nanoparticles
- (2013) Chi-Hang Tsai et al. CORROSION SCIENCE
- X-ray photoelectron spectroscopic study of the formation of Cu/Ni interface mediated by oxide phase
- (2013) Toshikazu Satoh et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging
- (2013) Yunhui Mei et al. JOURNAL OF ELECTRONIC MATERIALS
- Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste
- (2013) Tomohiro Yamakawa et al. JOURNAL OF ELECTRONIC MATERIALS
- Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles
- (2013) Jianfeng Yan et al. MATERIALS TRANSACTIONS
- Migration issues in sintered-silver die attaches operating at high temperature
- (2013) R. Riva et al. MICROELECTRONICS RELIABILITY
- Thermal characterizations of Cu nanoparticle joints for power semiconductor devices
- (2013) T. Ishizaki et al. MICROELECTRONICS RELIABILITY
- Microstructure of metallic copper nanoparticles/metallic disc interface in metal-metal bonding using them
- (2013) Yoshio Kobayashi et al. SURFACE AND INTERFACE ANALYSIS
- Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application
- (2012) Jianfeng Yan et al. JOURNAL OF ELECTRONIC MATERIALS
- A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding
- (2012) Toshitaka Ishizaki et al. JOURNAL OF MATERIALS CHEMISTRY
- Microstructural stability of Ag sinter joining in thermal cycling
- (2012) Soichi Sakamoto et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Ag Dewetting in Cu@Ag Monodisperse Core–Shell Nanoparticles
- (2012) Anya Muzikansky et al. Journal of Physical Chemistry C
- Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution
- (2011) Y. Kobayashi et al. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
- Mechanical properties of nano-silver joints as die attach materials
- (2011) Kim S. Siow JOURNAL OF ALLOYS AND COMPOUNDS
- A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles
- (2011) Y. Morisada et al. JOURNAL OF ELECTRONIC MATERIALS
- Preparation of PVP coated Cu NPs and the application for low-temperature bonding
- (2011) Yan Jianfeng et al. JOURNAL OF MATERIALS CHEMISTRY
- Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37
- (2011) Bálint Medgyes et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Oxidation behavior of copper nanoparticles at low temperature
- (2011) Akihiro Yabuki et al. MATERIALS RESEARCH BULLETIN
- Enhancements of thermal conductivities with Cu, CuO, and carbon nanotube nanofluids and application of MWNT/water nanofluid on a water chiller system
- (2011) MinSheng Liu et al. Nanoscale Research Letters
- A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles
- (2010) Y. Morisada et al. JOURNAL OF ELECTRONIC MATERIALS
- Swelling of Copper Powders during Sintering of Heat Pipes in Hydrogen-Containing Atmospheres
- (2010) Yueh-Ju Lin et al. MATERIALS TRANSACTIONS
- Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties
- (2010) Y. Kobayashi et al. SOLID STATE SCIENCES
- Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability
- (2010) Shlomo Magdassi et al. Materials
- Optimal design of coating material for nanoparticles and its application for low-temperature interconnection
- (2009) Motoi Tobita et al. JOURNAL OF NANOPARTICLE RESEARCH
Find Funding. Review Successful Grants.
Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.
ExploreDiscover Peeref hubs
Discuss science. Find collaborators. Network.
Join a conversation