Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol

Published 2020 View Full Article

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Title
Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol
Authors
Keywords
Sintering, Copper, Decomposition, Nanostructural materials, Copper formate
Journal
SCRIPTA MATERIALIA
Volume 182, Issue -, Pages 74-80
Publisher
Elsevier BV
Online
2020-03-07
DOI
10.1016/j.scriptamat.2020.02.045

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