A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles

Title
A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 39, Issue 8, Pages 1283-1288
Publisher
Springer Nature
Online
2010-04-06
DOI
10.1007/s11664-010-1195-3

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