Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle

Published 2018 View Full Article

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Title
Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle
Authors
Keywords
Nano-paste, Oxidation resistance, Cu–Cu joints, Electronic device, Sintering
Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 253, Issue -, Pages 27-33
Publisher
Elsevier BV
Online
2017-11-03
DOI
10.1016/j.jmatprotec.2017.11.001

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