Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Preparation and Low-Temperature Sintering of Cu Nanoparticles for High-Power Devices

(2012) Shutesh Krishnan et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution

(2011) Y. Kobayashi et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Mechanical properties of nano-silver joints as die attach materials

(2011) Kim S. Siow   JOURNAL OF ALLOYS AND COMPOUNDS

A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

(2011) Dhafer Abdulameer Shnawah et al.   MICROELECTRONICS RELIABILITY

Preparation of copper nanoparticles in a water/oleic acid mixed solvent via two-step reduction method

(2010) Jin Wen et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

A review on the application of inorganic nano-structured materials in the modification of textiles: Focus on anti-microbial properties

(2010) Roya Dastjerdi et al.   COLLOIDS AND SURFACES B-BIOINTERFACES

A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles

(2010) Y. Morisada et al.   JOURNAL OF ELECTRONIC MATERIALS

Electrical conductivity of copper nanoparticle thin films annealed at low temperature

(2010) Akihiro Yabuki et al.   THIN SOLID FILMS

Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability

(2010) Shlomo Magdassi et al.   Materials

Optimal design of coating material for nanoparticles and its application for low-temperature interconnection

(2009) Motoi Tobita et al.   JOURNAL OF NANOPARTICLE RESEARCH

Study of Bonding Technology Using Silver Nanoparticles

(2008) Toshiaki Morita et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Ink-Jet Printing of Cu−Ag-Based Highly Conductive Tracks on a Transparent Substrate

(2008) Kyoohee Woo et al.   LANGMUIR