Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres

Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

(2016) Xiangdong Liu et al.   SCRIPTA MATERIALIA

Copper pastes using bimodal particles for flexible printed electronics

(2015) Sze Kee Tam et al.   JOURNAL OF MATERIALS SCIENCE

Die-attaching silver paste based on a novel solvent for high-power semiconductor devices

(2015) Jinting Jiu et al.   JOURNAL OF MATERIALS SCIENCE

Effects of Reducing Solvent on Copper, Nickel, and Aluminum Joining Using Silver Nanoparticles Derived from a Silver Oxide Paste

(2015) Tomo Ogura et al.   MATERIALS TRANSACTIONS

Fabrication of a flexible copper pattern based on a sub-micro copper paste by a low temperature plasma technique

(2015) Yue Gao et al.   RSC Advances

Recent advances on dielectrics technology for SiC and GaN power devices

(2014) F. Roccaforte et al.   APPLIED SURFACE SCIENCE

Low Temperature Consolidation of Micro/Nanosilver Die-Attach Preforms

(2014) Jared McCoppin et al.   JOURNAL OF ELECTRONIC MATERIALS

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

(2014) R. Khazaka et al.   JOURNAL OF ELECTRONIC MATERIALS

Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics

(2014) Sung-Jun Joo et al.   NANOTECHNOLOGY

1D Copper Nanostructures: Progress, Challenges and Opportunities

(2014) Sushrut Bhanushali et al.   Small

Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices

(2013) Soichi Sakamoto et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Bondability of Copper Joints Formed Using a Mixed Paste of Ag2O and CuO for Low-Temperature Sinter Bonding

(2013) Tomo Ogura et al.   MATERIALS TRANSACTIONS

Low-Temperature and Low-Pressure Die Bonding Using Thin Ag-Flake and Ag-Particle Pastes for Power Devices

(2013) Sakamoto Soichi et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding

(2012) Toshitaka Ishizaki et al.   JOURNAL OF MATERIALS CHEMISTRY

Effects of Solvent Type on Low-Temperature Sintering of Silver Oxide Paste to Form Electrically Conductive Silver Film

(2011) Inyoung Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles

(2011) Y. Morisada et al.   JOURNAL OF ELECTRONIC MATERIALS

Copper nanoparticles synthesized by hydroxyl ion assisted alcohol reduction for conducting ink

(2011) Jhon L. Cuya Huaman et al.   JOURNAL OF MATERIALS CHEMISTRY

Low-temperature low-pressure die attach with hybrid silver particle paste

(2011) K. Suganuma et al.   MICROELECTRONICS RELIABILITY

Die Attach Materials for High Temperature Applications: A Review

(2011) V R Manikam et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

The Growth Mechanism of Copper Nanowires and Their Properties in Flexible, Transparent Conducting Films

(2010) Aaron R. Rathmell et al.   ADVANCED MATERIALS

A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices

(2010) Hui Shun Chin et al.   METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE

Synthesis of silver nanorods and application for die attach material in devices

(2009) Jinting Jiu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS