Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration

Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy

(2023) Yu-An Shen et al.   INTERMETALLICS

Temperature Gradient Induced Orientation Change of Bi Grains in Sn–Bi57–Ag0.7 Solder Joint

(2022) Yinbo Chen et al.   Acta Metallurgica Sinica-English Letters

Effects of various second phase ratios and contents on microstructure and mechanical properties of eutectic Sn58Bi alloy

(2022) Yuhang Wei et al.   MATERIALS & DESIGN

Solderable conductive paste for electronic textiles

(2022) Jia-Xiu Wu et al.   Journal of the Taiwan Institute of Chemical Engineers

Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In

(2021) Yuki Hirata et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Extremely thin interlayer of multi-element intermetallic compound between Sn-based solders and FeCoNiMn high-entropy alloy

(2021) Yu-An Shen et al.   APPLIED SURFACE SCIENCE

Optimization of TSV Leakage in Via-Middle TSV Process for Wafer-Level Packaging

(2021) Xuanjie Liu et al.   Electronics

Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding

(2021) Jhih-Jhu Jhan et al.   Journal of the Taiwan Institute of Chemical Engineers

Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy

(2020) Guang Ren et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Impact of Microstructure Evolution on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn–Ag–Cu Solder Interconnects

(2020) Tae-Kyu Lee et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Thermomigration induced microstructure and property changes in Sn-58Bi solders

(2019) Yu-An Shen et al.   MATERIALS & DESIGN

On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates

(2019) Guang Ren et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging

(2018) Shiqi Zhou et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys

(2018) Eric Dalton et al.   MATERIALS & DESIGN

Solid-State Diffusion of Bi in Sn: Effects of β-Sn Grain Orientation

(2018) André M. Delhaise et al.   JOURNAL OF ELECTRONIC MATERIALS

Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition

(2017) Y. Zhong et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Study of Solid-State Diffusion of Bi in Polycrystalline Sn Using Electron Probe Microanalysis

(2017) André M. Delhaise et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration

(2017) Fengjiang Wang et al.   MICROELECTRONICS RELIABILITY

The effects of antimony additions on microstructures, thermal and mechanical properties of Sn-8Zn-3Bi alloys

(2017) Guang Ren et al.   MATERIALS & DESIGN

Inkjet printing technology for increasing the I/O density of 3D TSV interposers

(2017) Behnam Khorramdel et al.   Microsystems & Nanoengineering

Thermomigration in solder joints

(2012) Chih Chen et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints

(2011) Richard Coyle et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions

(2011) Maurice N. Collins et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Wetting in Soldering and Microelectronics

(2008) T. Matsumoto et al.   Annual Review of Materials Research