Temperature Gradient Induced Orientation Change of Bi Grains in Sn–Bi57–Ag0.7 Solder Joint
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Title
Temperature Gradient Induced Orientation Change of Bi Grains in Sn–Bi57–Ag0.7 Solder Joint
Authors
Keywords
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Journal
Acta Metallurgica Sinica-English Letters
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2022-01-06
DOI
10.1007/s40195-021-01357-4
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