Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration
出版年份 2023 全文链接
标题
Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration
作者
关键词
-
出版物
Journal of the Taiwan Institute of Chemical Engineers
Volume 146, Issue -, Pages 104871
出版商
Elsevier BV
发表日期
2023-04-20
DOI
10.1016/j.jtice.2023.104871
参考文献
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