Study of Solid-State Diffusion of Bi in Polycrystalline Sn Using Electron Probe Microanalysis

Authors

Keywords

Diffusion, solder, aging, bismuth, EPMA

Journal

Volume 47, Issue 3, Pages 2057-2065

Publisher

Springer Nature

Online

2017-12-13

DOI

10.1007/s11664-017-6011-x

References

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