Inkjet printing technology for increasing the I/O density of 3D TSV interposers

Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications

(2017) Mikhail Asiatici et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Fabrication and electrical characterization of partially metallized vias fabricated by inkjet

(2016) B Khorramdel et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

3-D Integration and Through-Silicon Vias in MEMS and Microsensors

(2015) Zheyao Wang   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Superconformal Filling of High Aspect Ratio through Glass Vias (TGV) for Interposer Applications Using TNBT and NTBC Additives

(2015) P. Ogutu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Laser sintering of copper nanoparticles on top of silicon substrates

(2015) A Soltani et al.   NANOTECHNOLOGY

Integrating MEMS and ICs

(2015) Andreas C. Fischer et al.   Microsystems & Nanoengineering

Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers

(2015) Juha Niittynen et al.   Scientific Reports