On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates

Published 2019 View Full Article

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Title
On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates
Authors
Keywords
Solder, Interfacial reaction, Intermetallics, SnZnBi alloys, Micro alloying
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume -, Issue -, Pages -
Publisher
Elsevier BV
Online
2019-03-20
DOI
10.1016/j.jallcom.2019.03.244

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