Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints

Published 2011 View Full Article

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Title
Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
Authors
Keywords
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Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 1, Issue 10, Pages 1583-1593
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2011-09-23
DOI
10.1109/tcpmt.2011.2140109
References
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