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Title
Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding
Authors
Keywords
Electrodeposition, Cu-Cu bonding, Microstructure, Nanograin, Grain growth
Journal
Journal of the Taiwan Institute of Chemical Engineers
Volume 132, Issue -, Pages 104127
Publisher
Elsevier BV
Online
2021-11-08
DOI
10.1016/j.jtice.2021.10.027
References
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