Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration

Published 2017 View Full Article

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Title
Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration
Authors
Keywords
Electromigration, Sn-Pb, Sn-Ag-Cu, Mixed solder, Intermetallic compound
Journal
MICROELECTRONICS RELIABILITY
Volume 73, Issue -, Pages 106-115
Publisher
Elsevier BV
Online
2017-04-29
DOI
10.1016/j.microrel.2017.04.031

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