Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy

The role of eutectic colonies in the tensile properties of a Sn–Zn eutectic solder alloy

(2020) Lidiane Silva Ramos et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates

(2019) Guang Ren et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Improved Reliability and Mechanical Performance of Ag Microalloyed Sn58Bi Solder Alloys

(2019) Guang Ren et al.   Metals

Glass-Cu joining by anodic bonding and soldering with eutectic Sn-9Zn solder

(2019) Lifang Hu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy

(2019) Athil Al-Ezzi et al.   JOURNAL OF ELECTRONIC MATERIALS

Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys

(2018) Eric Dalton et al.   MATERIALS & DESIGN

Low-Temperature High-Frequency Induction Brazing of 5052 Aluminum Alloy to Stainless Steel with Sn-Zn Solder

(2018) Gaoyang Yu et al.   JOM

Effects of Cu and In Trace Elements on Microstructure and Thermal and Mechanical Properties of Sn-Zn Eutectic Alloy

(2018) P. Pandey et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrate

(2017) Ervina Efzan Mhd Noor et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Effect of Ni addition on the wettability and microstructure of Sn2.5Ag0.7Cu0.1RE solder alloy

(2017) Yaoli Wang et al.   MATERIALS & DESIGN

The effects of antimony additions on microstructures, thermal and mechanical properties of Sn-8Zn-3Bi alloys

(2017) Guang Ren et al.   MATERIALS & DESIGN

Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-Free solder alloys

(2016) Maurice N. Collins et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

(2016) Guang Ren et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

(2015) Xiaowu Hu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder

(2013) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters

(2013) A.A. El-Daly et al.   MATERIALS & DESIGN

Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions

(2013) A.A. El-Daly et al.   MATERIALS & DESIGN

Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy

(2013) A.A. El-Daly et al.   MATERIALS & DESIGN

Surface finish effect on reliability of SAC 305 soldered chip resistors

(2013) Maurice N. Collins et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

(2012) A.A. El-Daly et al.   MATERIALS & DESIGN

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

(2012) A.A. El-Daly et al.   MATERIALS & DESIGN

Evaluation of creep properties for Sn–Ag–Cu micro solder joint by multi-temperature stress relaxation test

(2012) Yoshihiko Kanda et al.   MICROELECTRONICS RELIABILITY

Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions

(2011) Maurice N. Collins et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Creep behavior of SnAgCu solders with rare earth Ce doping

(2010) Liang ZHANG et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA