Thermomigration induced microstructure and property changes in Sn-58Bi solders

Published 2019 View Full Article

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Title
Thermomigration induced microstructure and property changes in Sn-58Bi solders
Authors
Keywords
Thermomigration, Sn-Bi solder, Phase segregation, Finite element method (FEM), Current crowding
Journal
MATERIALS & DESIGN
Volume 166, Issue -, Pages 107619
Publisher
Elsevier BV
Online
2019-01-27
DOI
10.1016/j.matdes.2019.107619

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