Interfacial reactions between Cu and SnAgCu solder doped with minor Ni

Published 2015 View Full Article

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Title
Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
Authors
Keywords
Ni, Microstructure, Grain size
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 622, Issue -, Pages 529-534
Publisher
Elsevier BV
Online
2014-11-04
DOI
10.1016/j.jallcom.2014.10.121

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