Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints

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Title
Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints
Authors
Keywords
Lead-free solder, Ga alloying, Melting points, Interfacial reaction, Shear strength, Fatigue property
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 622, Issue -, Pages 973-978
Publisher
Elsevier BV
Online
2014-11-17
DOI
10.1016/j.jallcom.2014.11.030

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