Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

Published 2008 View Full Article

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Title
Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 478, Issue 1-2, Pages 121-127
Publisher
Elsevier BV
Online
2008-11-26
DOI
10.1016/j.jallcom.2008.11.052

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