Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process

Published 2012 View Full Article

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Title
Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 554, Issue -, Pages 195-203
Publisher
Elsevier BV
Online
2012-12-14
DOI
10.1016/j.jallcom.2012.12.019

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