Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders

Published 2014 View Full Article

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Title
Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders
Authors
Keywords
-
Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 608, Issue -, Pages 130-138
Publisher
Elsevier BV
Online
2014-04-29
DOI
10.1016/j.msea.2014.04.070

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