Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints
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Title
Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints
Authors
Keywords
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Journal
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
Volume 50, Issue 1, Pages 480-492
Publisher
Springer Nature
Online
2018-10-26
DOI
10.1007/s11661-018-4983-7
References
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