Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material

Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process

(2021) Muhammad Iqbal Ahmad et al.   Metals

Design Optimization of Pillar Bump Structure for Minimizing the Stress in Brittle Low K Dielectric Material Layer

(2019) Xin-Jiang Long et al.   Acta Metallurgica Sinica-English Letters

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

(2018) Lei Shi et al.   JOURNAL OF ELECTRONIC PACKAGING

Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy

(2018) Shiqi Zhou et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array

(2016) Fei Chong Ng et al.   MICROELECTRONICS RELIABILITY

Numerical investigations on the effects of different cooling periods in reflow-soldering process

(2015) C. Srivalli et al.   HEAT AND MASS TRANSFER

Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan

(2015) A.M. Najib et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow

(2015) M. S. Abdul Aziz et al.   NUMERICAL HEAT TRANSFER PART A-APPLICATIONS

Thermal fluid-structure interaction of PCB configurations during the wave soldering process

(2015) M.S. Abdul Aziz et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Stress Analysis and Design Optimization for Low- $k$ Chip With Cu Pillar Interconnection

(2015) Fa Xing Che et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

CFD modeling of pin shape effects on capillary flow during wave soldering

(2014) M.S. Abdul Aziz et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

An RDL UBM Structural Design for Solving Ultralow-K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging

(2014) K. M. Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

Influence of solder bump arrangements on molded IC encapsulation

(2014) C.Y. Khor et al.   MICROELECTRONICS RELIABILITY

Influence of PTH offset angle in wave soldering with thermal-coupling method

(2014) Mohd Sharizal Abdul Aziz et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement

(2014) Weisheng Xia et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach

(2013) M.S. Abdul Aziz et al.   INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

(2012) Chun‐Sean Lau et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging

(2011) Chu Yee Khor et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder

(2008) S.M.L. Nai et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders

(2008) Ikuo Shohji et al.   MATERIALS TRANSACTIONS