Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

Published 2012 View Full Article

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Title
Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process
Authors
Keywords
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Journal
SOLDERING & SURFACE MOUNT TECHNOLOGY
Volume 24, Issue 2, Pages 77-91
Publisher
Emerald
Online
2012-03-31
DOI
10.1108/09540911211214659
References
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