Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement

Application of Lamination Theory to Study Warpage Across PWB and PWBA During Convective Reflow Process

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Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation

(2011) T. T. Nguyen et al.   JOURNAL OF ELECTRONIC MATERIALS

Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading

(2009) Ming-Yi Tsai et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

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Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

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Reliability of Lead-Free BGA Assembly: Correlation Between Accelerated Ageing Tests and FE Simulations

(2008) Alexandrine GuÉdon-Gracia et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY