Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging

Effect of geometry on the fracture behavior of lead-free solder joints

(2011) Siva P.V. Nadimpalli et al.   ENGINEERING FRACTURE MECHANICS

Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process

(2011) C.Y. Khor et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Study on the fluid/structure interaction at different inlet pressures in molded packaging

(2011) C.Y. Khor et al.   MICROELECTRONIC ENGINEERING

Effect of vertical stacking dies on flow behavior of epoxy molding compound during encapsulation of stacked-chip scale packages

(2010) C. Y. Khor et al.   HEAT AND MASS TRANSFER

Stabilized filling simulation of microchip encapsulation process

(2010) Hui Wang et al.   MICROELECTRONIC ENGINEERING

Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds

(2010) Thomas Schreier-Alt et al.   MICROELECTRONICS RELIABILITY

Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding

(2009) C.Y. Khor et al.   INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength Through Modeling and Testing

(2009) Chia-Yen Tan et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of bump size on current density and temperature distributions in flip-chip solder joints

(2009) Wei-Chih Kuan et al.   MICROELECTRONICS RELIABILITY

Simulation of Migration Effects in Solder Bumps

(2008) K. Weide-Zaage   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Simulations and experiments of three-dimensional paddle shift for IC packaging

(2007) Shiang-Yu Teng et al.   MICROELECTRONIC ENGINEERING