Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Title
Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume 140, Issue 1, Pages 011002
Publisher
ASME International
Online
2017-10-23
DOI
10.1115/1.4038245

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