Design Optimization of Pillar Bump Structure for Minimizing the Stress in Brittle Low K Dielectric Material Layer

Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method

(2019) Lin Jiang et al.   Acta Metallurgica Sinica-English Letters

Comparative Study on Solid-State and Metastable Liquid-State Aging for SAC305/Cu Joints

(2018) Shuang Li et al.   Acta Metallurgica Sinica-English Letters

Numerical Investigation on Residual Stresses of the Safe-End/Nozzle Dissimilar Metal Welded Joint in CAP1400 Nuclear Power Plants

(2018) Wen-Chao Dong et al.   Acta Metallurgica Sinica-English Letters

Analytical thermal stress model for a typical flip-chip (FC) package design

(2017) E. Suhir   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

CPI Parametric Investigation of UBM-Al Interface for Cu Pillar Flip-Chip Application

(2016) Prayudi Lianto et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Effect of Cold Rolling Parameters on the Longitudinal Residual Stress Distribution of GH4169 Alloy Sheet

(2015) Neng-Yong Ye et al.   Acta Metallurgica Sinica-English Letters