Thermal fluid-structure interaction of PCB configurations during the wave soldering process

CFD modeling of pin shape effects on capillary flow during wave soldering

(2014) M.S. Abdul Aziz et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach

(2013) M.S. Abdul Aziz et al.   INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

(2013) Wei Chiat Leong et al.   MICROELECTRONICS INTERNATIONAL

Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method

(2012) Chun-Sean Lau et al.   MICROELECTRONICS RELIABILITY

FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process

(2012) Ernest E.S. Ong et al.   MICROELECTRONICS RELIABILITY

Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology

(2012) C.Y. Khor et al.   SIMULATION MODELLING PRACTICE AND THEORY

Three‐dimensional thermal investigations at board level in a reflow oven using thermal‐coupling method

(2012) Chun‐Sean Lau et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY