Influence of PTH offset angle in wave soldering with thermal-coupling method

Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach

(2013) M.S. Abdul Aziz et al.   INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package

(2012) C.Y. Khor et al.   INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

Effects of outlet vent arrangement on air traps in stacked-chip scale package encapsulation

(2012) D. Ramdan et al.   INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

Three‐dimensional thermal investigations at board level in a reflow oven using thermal‐coupling method

(2012) Chun‐Sean Lau et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

(2012) Chun‐Sean Lau et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Fluid/Structure Interaction Investigation in PBGA Packaging

(2012) D. Ramdan et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Study on the fluid/structure interaction at different inlet pressures in molded packaging

(2011) C.Y. Khor et al.   MICROELECTRONIC ENGINEERING

Investigation of the fluid/structure interaction phenomenon in IC packaging

(2011) C.Y. Khor et al.   MICROELECTRONICS RELIABILITY

Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance

(2011) W.C. Leong et al.   MICROELECTRONICS RELIABILITY

FSI Simulation of Wire Sweep PBGA Encapsulation Process Considering Rheology Effect

(2011) Dadan Ramdan et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging

(2011) Chu Yee Khor et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Three-Dimensional Modelling to Study the Effect of Die-Stacking Shape on Mould Filling During Encapsulation of Microelectronic Chips

(2010) M Khalil Abdullah et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING

Stabilized filling simulation of microchip encapsulation process

(2010) Hui Wang et al.   MICROELECTRONIC ENGINEERING

Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging

(2007) Tomohisa Hashimoto et al.   COMPUTERS & FLUIDS

Simulations and experiments of three-dimensional paddle shift for IC packaging

(2007) Shiang-Yu Teng et al.   MICROELECTRONIC ENGINEERING